RAID Subsystem DVA-08K
DVA-08K SCSI Premium Series
en Installation Manual
RAID Subsystem DVA-08K | Installation Manual
Table of Contents | en
3
Warnings and Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Enclosure Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chassis Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Front Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Hard Drive Numbering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Rear Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Backplane Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Subsystem Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
LCD Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Drive Trays. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
The RAID Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Battery Backup Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Power Supply Units. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Cooling Fan Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Subsystem Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
I C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
LED Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Firmware and Bosch RAIDWatch GUI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Audible Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Hot-Swappable Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Hot-Swap Capabilities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Normalized Airflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Hardware Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Installation Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Precautions and Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Static-Free Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
BBU Warnings and Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
General Installation Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Installation Procedure Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Unpacking the Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Rackmounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Considerations for Installation Site and Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Mounting Holes Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Drive Tray Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Subsystem Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Subsystem Monitoring Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Status-indicating LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Brief Overview of the LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Drive Tray LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Controller Module LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Ethernet Port LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
BBU Module LED. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
PSU LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
LCD Keypad Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Cooling Fan Module LED. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Audible Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Default Threshold Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Failed Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.3.2
4.4
2
I C Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
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Basic Configuration Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
SCSI Connection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Host Connection Topology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
LCD Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Subsystem Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Replacing Controller Module Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Selecting a Memory Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
DIMM Module Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Replacing a Faulty BBU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Notes on PSU Module Maintenance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Replacing the PSU Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Notes on Cooling Fan Module Maintenance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Replacing a Cooling Fan Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Replacing a Failed Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Appendix: Spare Parts and Accessories. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Spare Parts Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Accessories and Optional Items. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Appendix: Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Null Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Main Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
10
Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
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Warnings and Certifications | en
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1
Warnings and Certifications
1.1
Warning
A shielded power cord is required in order to meet FCC emission limits and also to prevent
interference to nearby radio and television reception.
Use only shielded cables to connect I/O devices to this equipment. You are cautioned that
changes or modifications not expressly approved by the party responsible for compliance
could void your authority to operate the equipment.
1.2
Safety Precautions
Precautions and Instructions
•
•
Prior to powering on the subsystem, ensure that the correct power range is being used.
The RAID subsystems come with drive bays. Leaving any of these drive bays empty will
seriously affect the efficiency of the airflow within the enclosure, and will consequently
lead to the system overheating, which can cause irreparable damage.
If a module fails, leave it in place until you have a replacement unit and you are ready to
replace it.
•
•
•
•
Airflow Consideration: The subsystem requires an airflow clearance, especially at the
front and the rear side.
Handle subsystem modules using the retention screws, extraction levers, and the metal
frames/faceplates. Avoid touching PCB boards and connector pins.
To comply with safety, emission, or thermal requirements, none of the covers or replace-
able modules should be removed. Make sure that during operation, all enclosure modules
and covers are securely in place.
•
•
•
Be sure that the rack cabinet into which the subsystem chassis will be installed provides
sufficient ventilation channels and airflow circulation around the subsystem.
Provide a soft, clean surface to place your subsystem on before working on it. Servicing
on a rough surface may damage the exterior of the chassis.
If it is necessary to transport the subsystem, repackage all disk drives separately. If using
the original package material, other replaceable modules can stay within the enclosure.
ESD Precautions
Observe all conventional anti-ESD methods while handling system modules. The use of a
grounded wrist strap and an anti-static work pad are recommended. Avoid dust or debris in
your work area.
1.3
Certification
FCC Class B Radio Frequency Interference Statement
FCC (applies in the U.S. and Canada)
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules (47 CFR, Part 2, Part 15 and CISPR PUB. 22
Class B). These limits are designed to provide reasonable protection against harmful interfer-
ence when the equipment is operated in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
this user’s manual, may cause harmful interference to radio communications. However, there
is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by
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turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
•
Consult the dealer or an experienced radio/TV technician for help
This device complies with Part 15 of FCC Rules. Operation is subjected to the following two
conditions: 1) this device may not cause harmful interference, and 2) this device must accept
any interference received, including interference that may cause undesired operation.
This device is in conformity with the EMC.
CB
(Certified Worldwide)
This device meets the requirements of the CB standard for electrical equipment with regard to
establishing a satisfactory level of safety for persons using the device and for the area sur-
rounding the apparatus. This standard covers only safety aspects of the above apparatus; it
does not cover other matters, such as style or performance.
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Introduction | en
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2
Introduction
This manual covers the DVA-08K series of RAID subsystems.
With its basic hardware redundancy and the capability of fast I/O transfer, the 2U RAID SATA
subsystem is an ideal solution to meet the ever increasing demands for addition of storage
capacity. Despite its ease of use, the subsystem does not compromise data protection for
convenience. The subsystem’s embedded firmware offers the same protection and mainte-
nance functionalities as those designed for an enterprise-level RAID solution. The subsystems
provide unprecedented configuration flexibility and allow for the customization of storage
subsystems to meet specific demands. It is a rigorous and durable subsystem that can be eas-
ily configured and operated.
Fully featured RAID redundancy (which provides advanced data protection) ensures that the
complete range of RAID levels (RAID 0, 1(0+1), 3, 5, 10, 30 and 50) is supported by the con-
troller head. A long list of sophisticated firmware functions (dedicated/global hot-spares, bat-
tery protected disk cache, configurable reaction schemes against drive errors, remote and
real-time array monitoring, and more) further guarantees the overall availability of valuable
data.
IT managers using the RAID subsystems will be able to rapidly develop a comprehensive stor-
age array. And the modular nature of the subsystem minimizes the maintenance effort to use
the RAID appliance.
2.1
Product Overview
The subsystem comes with two (2) SCSI-320 host channels interfaced through four (4) VHDCI
68-pin SCSI ports. The subsystem comes in a 2U-profile rack-mountable chassis which houses
a RAID controller module featuring complete RAID configuration and data protection function-
ality. The subsystem’s operation is protected by redundant, hot-swappable power supplies
and cooling fan modules. Designed for a high level availability, all major components are hot-
replaceable including its Li-ION battery and the RAID-protected disk drives.
The subsystem supports high-density array capacity by its eight drive bays for SATA-II inter-
face disk drives. The subsystem facilitates large I/O transfer, over its dual PCI-X buses archi-
tecture, and transmission of block I/Os over flexible caching and a dedicated XOR engine. The
subsystem is ideal for direct-attached data storage, backup, and retrieval. It combines the
capabilities and block-level performance of RAID storage with the reliable SCSI transfer tech-
nologies.
Configured arrays are easily combined with multiple ID/LUNs that appear to the host ports,
turning massive capacity into manageable units for data-sharing in a heterogeneous environ-
ment.
The RAID 2U-profile, SCSI-to-SATA RAID storage comes in two different models. The only dif-
ference between the two models is the number of SATA-II drive bays.
SCSI Host Ports
Connectivity: The subsystem features a 320MB/s bandwidth from each of its SCSI host chan-
nels. The dual-stack VHDCI connectors on the rear panel facilitate the connection to multiple
host computers and combining the storage capacities of multiple RAID subsystems. Its back-
ward compatibility with older SCSI protocols requires minimum investment for upgrading
equipment. Storage volumes are associated with SCSI ID/LUNs on the host channels. The
subsystem firmware provides flexible configurations of storage volumes which include, logical
drives in supported RAID 0, 1 (0+1), 3, and 5 levels, logical volumes that consist of one or
more logical drives, and the logical partitions of the previously mentioned configurations.
These volumes then appear as SCSI targets over the host links.
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Channels: The SCSI ID/LUN mapping method enables users to associate a storage volume
with multiple IDs or LUNs on the host channels. The mapping method can easily cope with
host-side configurations such as clustered servers or high availability path redundancy. On the
drive side, all of the eight (8) SATA-II drives are connected each through a dedicated SATA
channel. Each drive channel is routed to an enclosure drive tray that is equipped with a stan-
dard SATA connector with of hot-swap capability. The methods used for assembling physical
drives, fault management, and status monitoring are identical to that used with Bosch’s long
line of RAID storage enclosures.
Active Components
The subsystem comes with:
•
•
•
•
•
A single RAID controller module
Two redundant, hot-swappable cooling modules
Dual redundant, hot-swappable, load-sharing power supplies
A module slot for a Li-ION battery module.
The front section of the enclosure houses eight (8) hot-swap drive bays for SATA-II or
backward compatible with SATA-I hard disk drives.
The subsystem is shown below:
Fig. 2.1 8-bay SATA RAID Subsystem
NOTICE!
On receiving and unpacking your subsystem, please check the package contents against the
included unpacking checklist. If any modules appear to be missing, please contact your sub-
system vendor immediately.
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Introduction | en
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2.2
Enclosure Chassis
2.2.1
Chassis Overview
The RAID subsystem comes in a 2U metal chassis. A backplane board divides the enclosure
internally into front and rear sections. The front section accommodates eight (8) drive trays
(with their associated hard drives) and the rear section accommodates two (2) PSU modules,
two (2) single-fan cooling modules, and a single RAID controller module. The two (2) forearm
handles on the front of the subsystem enable you to easily insert/extract the chassis into/from
a rack or cabinet. Pre-drilled mounting holes on the sides of the chassis allow you to attach
separately purchased slide rails.
Fig. 2.2 Top View of the RAID subsystem
CAUTION!
When working with the subsystem, it is important to use tools with extreme care. Do not place
tools or other items on top of the enclosure to help avoid damaging the chassis finish.
2.2.2
2.2.3
Physical Dimensions
The subsystem comes in a standard 2U, 19” chassis with the following dimensions:
•
•
Measured with forearm handles: 482mm x 88mm x 505mm (width x height x depth)
Measured without forearm handles: 446mm x 88mm x 490mm (width x height x depth)
Front Panel Overview
The front section of the subsystem features a 4 x 2 layout for eight (8) 3.5-inch disk drives and
a foldable LCD keypad panel. The front panels of the RAID subsystems described in this man-
ual are shown in Figure 2.3. A description of the front panel component is given below:
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Fig. 2.3 Front View
The front panel is designed to accommodate the following components:
•
Forearm handles with an LCD keypad panel: The LCD Panel mounted on the left handle
shows system information and provides local access to the firmware-embedded configu-
ration and monitoring utility.
•
Drive bays with drive tray canisters: The drive bays are used to house the subsystem hard
drives. The DVA-08K contains 8 drive bays with a blank plate covering the lower part of
the front panel.
2.2.4
Hard Drive Numbering
The subsystem is housed in an enclosure that is 4 bays wide and 2 bays high. When viewed
from the front, drive bays (slots) are numbered 1 to 8, from the left to the right, and then from
the top to the bottom.
Fig. 2.4 Drive Bays Numbering Sequence
2.2.5
Rear Panel Overview
The rear section of the subsystems are accessed through the rear panel and is reserved for a
(PSUs), and two cooling fan modules.
The subsystem rear view is shown in Figure 2.5. A description of the rear panel component is
given in the proceeding discussions:
Fig. 2.5 Rear View
The rear panel shown above is designed to accommodate the following components:
•
RAID controller module: The controller module contains a controller main board and a
pre-installed DDR DIMM module.
•
Power Supply Unit (PSU): The PSU is used to provide power to the subsystem.
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•
•
BBU module: A BBU provides the protective implementation to cached data; and, unless
deselected when purchasing the subsystems, is installed into the module slot located at
the upper left corner of the controller module.
Cooling fan module: The redundant cooling fan module is used to ventilate the subsystem
and to reduce the temperature within the subsystem.
NOTICE!
Each of the power supplies on the sides of the enclosure houses one cooling fan module in a
removeable canister. When a power supply is removed, the cooling module is also removed.
Therefore, replace the power supply unit as soon as possible whenever it becomes necessary.
Cooling fan modules can be independently removed from the chassis without affecting PSU
operation.
i
2.2.6
Backplane Board
An integrated backplane board separates the front and rear sections of the subsystem. The
PCB board provides traces for logic level signal traces and low voltage power paths. It con-
tains no user-serviceable components.
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